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  • ADT – Dicing Blades

    ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.

    Key Features

    • Designed for cutting hard and brittle materials
    • Minimizes chipping and cracking
    • Long-lasting performance
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  • ADT – Dicing Peripheral

    ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.

     

    Key Features

    • Used for dicing wafers and substrates into smaller chips
    • High accuracy and low kerf loss for optimal yield
    • Compatible with a wide range of materials and thicknesses
    • Robust and durable design for long-term use
    • Offers advanced automated blade height adjustment and real-time monitoring.
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  • ADT – Dicing Saw

    Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.

    Key Features 

    • New User Interface (NUI) Upgrade Kit
    • Dicing Floor Management (DFM)
    • Height Measurement Tool (HMT)
    • Dressing Procedure
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