The TRA series is the outcome of realizing Econology and offers the best performance. Satisfying the economic effectiveness and practicality of your business.

The TSM N2 Reflow is a high-end reflow oven that provides precise temperature control for the most demanding soldering applications. It features a nitrogen atmosphere that minimizes oxidation and improves soldering quality, ensuring consistent and reliable results. With a compact design and intuitive user interface, the TSM N2 Reflow is a must-have for any electronics manufacturing facility looking to achieve the highest levels of quality and efficiency.

Key Features

• Realize Flux Zero in OVEN -> equip FMS applied with patent technology
• Thermal Interference Innovation in each zone -> Able to set up temperature difference with 60ºC in max. of interzone
• Internal Heat Reduction of Reflow -> apply New Emission System
• Real-time Monitoring,temperature Profile Monitoring and Oxygen Concentration Monitoring in each zone
• Conveyor Vibration Monitoring

The TRV series offers the outstanding productivity and safety operation of equipment. Particularly , the Compact Vacuum Chamber and Conveyor are technically proved solutions in the field through a technical partnership with ETC.

Key Features

• Completely sealable TSM’s vacuum Reflow, dedicated compression chamber
• Transfer System without jamming PCB (technical partnership with ETC)
• Prevent PCB Drop by minimizing the gab between in/outlet entrance of conveyor in vacuum chamber
• Strengthen durability without conveyor driven roller in high temperature section
• Able to correspond with minimized vacuum chamber with embedded vacuum pump
• Reduce time of vacuuming and easily control vacuum