The iS6052 SPI is Viscom’s cutting-edge solution for precise solder paste inspection in SMD production. With over four decades of expertise behind it, this 3D inline system ensures comprehensive evaluation of key solder features such as volume, height, shape, and more. Advanced sensor technology, including an orthogonal camera and four lateral views, enhances inspection accuracy, while realistic color imaging accelerates verification. The Fast Flow handling system boosts throughput, synchronizing assembly flow seamlessly and minimizing handling times. Equipped with intelligent networking capabilities, the iS6052 SPI offers superior process stability and efficiency for modern SMT lines. 

The iS6052 THT inspection system is the most efficient quality control inspection of Viscom. Engineered for precise component placement verification on THT (Through-Hole Technology) boards. Utilizing advanced AOI (Automated Optical Inspection) technology, it inspects from above the PCB, setting it apart from conventional systems that inspect from below. Designed for accuracy and efficiency, the iS6052 THT ensures reliable quality assurance in THT assembly processes.

The iX7059 One can guarantee exceptional precision, with a resolution down to 1µm, ensuring every detail is captured with accuracy. This advanced system offers versatile 2D, 2.5D, and 3D X-ray inspection capabilities, making it perfect for semiconductor, power module, and leadframe applications. Designed for 100% inline inspection, the iX7059 One excels in detection, providing reliable performance for high-volume production. With easy programming and seamless integration, it’s the ideal solution for manufacturers seeking consistent quality and efficiency.