Showing 17–20 of 1952 results

  • ADT – Dicing Blades

    ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades...

    ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.

    Key Features

    • Designed for cutting hard and brittle materials
    • Minimizes chipping and cracking
    • Long-lasting performance
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  • ADT – Dicing Peripheral

    ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and ex...

    ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.

     

    Key Features

    • Used for dicing wafers and substrates into smaller chips
    • High accuracy and low kerf loss for optimal yield
    • Compatible with a wide range of materials and thicknesses
    • Robust and durable design for long-term use
    • Offers advanced automated blade height adjustment and real-time monitoring.
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  • ADT – Dicing Saw

    Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. ...

    Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.

    Key Features 

    • New User Interface (NUI) Upgrade Kit
    • Dicing Floor Management (DFM)
    • Height Measurement Tool (HMT)
    • Dressing Procedure
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  • Agilent – 8700 LDIR Chemical Imaging System

    The Agilent 8700 Laser Direct Infrared (LDIR) chemical imaging system provides a sophisticated new approach to chemical imaging and IR spectral analysis. Designed to be used by both experts and nonexperts alike, the 8700 LDIR provides a simple hig...

    The Agilent 8700 Laser Direct Infrared (LDIR) chemical imaging system provides a sophisticated new approach to chemical imaging and IR spectral analysis. Designed to be used by both experts and nonexperts alike, the 8700 LDIR provides a simple highly automated approach for obtaining reliable high-definition chemical images of constituents on surface.

    Using the 8700 LDIR, you can analyze more samples, in greater detail, in minutes vs. hours. This robust solution provides you with more statistical data than ever to aid in the compositional analysis of tablets, laminates, tissues, polymers, and fibers. With more meaningful information available, you can make more informed, faster decisions in product development reducing both costs and analysis time.

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