ADT – Dicing Peripheral

  • INDONESIA

    Maggie Yang, Assistant General Manager

    PT. DKSH Indonesia
    AIA Central 39th floor. Jalan Jenderal Sudirman Kavling 48A
    12930 Jakarta Selatan
    Indonesia

    +62 81 7988 2288

    +62 22 2988 7870

    Email

  • MALAYSIA

    Tay Tun Yong, Technical Sales & Services Manager

    DKSH Technology Sdn. Bhd.
    No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
    11900 Bayan Lepas, Penang
    Malaysia

    +60 4 645 2672

    Email

  • SINGAPORE

    Kelvin Low, Senior Manager

    DKSH Singapore Pte Ltd
    625 Lorong 4 Toa Payoh, #03-00
    319519 Singapore
    Singapore

    +65 6274 1222

    +65 6273 1503

    Email

  • THAILAND

    Lau Chek Chung, General Manager, Semiconductor & Electronics, Malaysia, Thailand and Vietnam

    DKSH (Thailand) Limited
    2106 Fantree 4 Building, Sukhumvit Road,
    Phrakhanong-Tai, Phrakhanong 10260 Bangkok
    Thailand

    +66 2 639 7000

    Email

  • VIETNAM

    Nguyen Phan Loan Anh, Assistant Sales Manager

    DKSH Technology Co.,Ltd
    5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12,
    District 10
    70000 Ho Chi Minh City
    Vietnam

    +84 8 38125806

    Email

  • VIETNAM

    Ly Thi Bich Duyen (Bella), Senior Supervisor

    DKSH Technology Co.,Ltd
    5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12,
    District 10
    70000 Ho Chi Minh City
    Vietnam

    +84 8 38125806

    Email

  • ADT Dicing Peripherals Brochure


ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.

 

Key Features

  • Used for dicing wafers and substrates into smaller chips
  • High accuracy and low kerf loss for optimal yield
  • Compatible with a wide range of materials and thicknesses
  • Robust and durable design for long-term use
  • Offers advanced automated blade height adjustment and real-time monitoring.

Available Models

Technical Spcifications

SpecificationsValue
Flow capacity<20 L/min
Supply pressure<5 bar
Dimensions (W x D x H)620 x 1280 x 1720 mm3
Air pressure6-8 bar

Designed for closed-loop, uniform supply of cutting water. It recycles drain water thru filtering, cooling and pumping to maintain required purification, temperature and flow levels for optimized dicing, cost saving and environment care.

Technical Spcifications

Specifications997997L
Max workpiece sizeØ 200 (8”) minØ 300 (12”) min
Spinner velocity range50-3,000 rpm50-2,000 rpm
Dimensions (W x D x H)410 x 625 x 946 mm3502 x 809 x 946 mm3
Weight120 Kg200 Kg

Designed for after-dicing workpiece cleaning and drying. Equipped with a spinning chuck table and a rotating washing/drying arm. The arm can be configured with an atomizing cleaning nozzle or a high pressure nozzle to cope with a wide range of cleanliness requirements.

Technical Spcifications

Specifications967967L
Supported tapesDicing Blue-tapes / UV tapesDicing Blue-tapes / UV tapes
Max Workpiece sizeØ 200 (8”) mmØ 300 (12”) mm
Dimensions (W x D x H)655 x 590 x 560 mm3791 x 706 x 557 mm3
Air pressure6-8 bar6-8 bar

Designed for quality, hands-free mounting of workpieces on tapes.
It features fast, consistent, precise and economic mounting at an exceptional cost-performance.

Technical Spcifications

Specifications996-8″996-12″
Max workpiece sizeØ 200 (8”) mmØ 300 (12”) mm
Temp control chuck heater<65 °c<65 °c
Dimensions (W x D x H)420 x 860 x 370 mm3550 x 1000 x 310 mm3
Air pressure45 bar60 bar

Designed for manual mounting of workpieces on tapes. Supporting various types of dicing tapes and standard frames. Can be customized for multiple substrates (multi-panel) and irregular frames.

Technical Spcifications

Specifications995-8″995-12″
Max. frame Diameter300 mm400 mm
Exposure area250 x 250 mm2Ø430 mm2
Dimensions (W x D x H)510 x 450 x 120 mm3645 x 526 x 180 mm3
Weight20 Kg30 Kg

Designed for after dicing UV tape curing to reduce the adhesive strength for ease of workpiece removal.

Technical Spcifications

SpecificationsValue
Temperature range8-35 °c
Stability±0.1 °c
Dimensions (W x D x H)526 x 360 x 555 mm3

Designed for closed-loop supply of spindle cooling water. It maintains stable, temperature-controlled water; an important factor for achieving high dicing accuracy and quality.

Technical Spcifications

SpecificationsValue
Resistivity setting range0.1-1 MΩ/cm
Water capacity*3-10 L/min
Dimensions (W x D x H)190 x 446 x 365 mm3
Weight6-8 Kg

Designed for decreasing the resistivity of deionized (DI) water to a predefined level. Aimed at preventing particle adhesion and damage caused by static discharge during the dicing process.

Key Industries

  • Semiconductor, Solar & Electronics

Brand

ADT Dicing

Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.

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